PANEL SIZE
Single Sided: Up to 12” x 18” (304,8mm x 457.2mm)
Double Sided: Up to 12” x 18” (304,8mm x 457.2mm)
Rigid-Flex: Up to 12” x 18” (304,8mm x 457.2mm)
Multi-layer: Up to 12” x 18” (304,8mm x 457.2mm)

DRILLED HOLE SIZE/LOCATION
Non-Plated Through Holes: .010” (0,25mm) minimum
Plated Through Holes: .010” (0,25mm) minimum
Drilled Hole to Drilled Hole: ± .003” (0,08mm)

LINE WIDTH/SPACES
Line: .005" (0,12mm)
Spaces: .005" (0,12mm)

LAYERS
3 Layers Maximum
Solid and Cross Hatched Copper Shielding
Pads Only Plating on Plated layer

BASE MATERIALS
Polyimide .0005” to .005” (0,013mm to 0,127mm) -
DuPont® Flexible Circuit Materials Information
All Clads Incorporate Flame Retardant Adhesive unless otherwise specified
Flammability Information - UL® Certifications Directory -
QMTS2.E124294    QMTS2.GuideInfo

(If you do not find the information at the two direct links above, please go to DuPont's® site, click the "UL Cards" link at the bottom of the list, then enter the card number E124294 in the search box and click the "search" button. Click on the link on the right side of the search results.)
(Adhesiveless - By request)

CONDUCTORS
½ ounce Copper - .0007” (0,018mm) thickness
1 ounce Copper - .0014” (0,036mm) thickness
2 ounce Copper - .0028” (0,071mm) thickness

STIFFENERS
G10/FR4
Polyimide
Other Materials - By Request

SURFACE FINISHES
Tin Plating
Hard Gold over Nickel Plating
Nickel Plating
Hot Air Level (HAL) Solder

SOLDER MASK
Liquid Photo-Imagable
Dry Film Photo-Imagable
Polyimide .0005” to .005” (0,013mm to 0,217mm)
Adhesive from .001” to .002” (0,025mm to 0,051mm)

Click here to view Samtec's process flow for manufacturing a Single Sided Flex Circuit.

View an on-line version of Samtec's New Flex Circuits Design Guide.

Click on the link to contact our Flex Circuits Group or email us at eFlexCircuits@samtec.com