Take your designs to the next generation of performance and beyond with fast, efficient solutions from IBM Microelectronics. Our products are enhanced through our expertise in semiconductor design and manufacturing and are ready for use in a wide range of applications.

ASIC’S: The comprehensive IBM suite of ASIC technologies can help you achieve first-pass design success. Our methodology can help simplify the integration of design elements for even the most complex and performance-driven designs. Our end-to-end design flow and ASIC offerings have helped industry leaders bring some of the world's largest and densest semiconductor chips to the marketplace.

FOUNDRY: Associated enablement and IBM foundry services provide end–to–end solutions for the consumer electronics, networking, automotive, wireless communications, power management, media and entertainment, and aerospace and defense markets. Our offerings include bulk complementary metal–oxide–semiconductor (CMOS), low–power CMOS, RF CMOS, silicon-germanium (SiGe), high voltage, and silicon-on-insulator (SOI) technologies.

Analog and mixed–signal offerings — Our analog and mixed–signal (AMS) expertise is demonstrated by silicon-germanium market leadership and extends into RF CMOS for wireless communication. We can provide world-class enablement including models that precisely correlate to hardware, and a local and factory technical support structure that is critical for complex AMS design.

CMOS — IBM CMOS offerings, targeted for digital content in mobile devices and consumer electronics, provide access to IBM development in advanced technology nodes. We offer flexible business models that enable engagements from a base technology offering to an end-to-end foundry solution that utilize the extensive vendor network of IBM Business Partners. The Common Platform technology collaboration provides manufacturing choice and flexibility that can help meet your needs as your business grows from prototyping to high-volume mass production.

CMOS image sensors — The CMOS image sensor (CIMG) foundry offering targets consumer products and emerging applications by combining IBM's 180–nm and 130–nm copper process technology with 4T image sensor IP. Its features include an integrated design kit along with access to IBM's image sensor circuit library and vendor-acquired circuit IP.

POWER PC: Power Architecture™ technology is an instruction-set architecture that spans applications from consumer electronics to supercomputers. Power Architecture encompasses PowerPC®, POWER4™, POWER5™ and POWER6™ processors.

What makes this microprocessing technology so different — and such a breakthrough? Scalability, flexibility and customization. Power is built on an open architecture, making it an open ecosystem that supports freedom of design in the marketplace.

MOSIS: MOSIS is a low-cost prototyping and small-volume production service for VLSI circuit development. Since 1981, MOSIS has fabricated more than 50,000 circuit designs for commercial firms, government agencies, and research and educational institutions around the world.

A Single Interface to the Semiconductor Industry
MOSIS provides designers with a single interface to the constantly changing technologies of the semiconductor industry. Mask generation, wafer fabrication, and device packaging are contracted to leading industry vendors.

Low Cost
MOSIS keeps the cost of fabricating prototype quantities low by aggregating multiple designs onto one mask set. This allows customers to share overhead costs associated with mask making, wafer fabrication, and assembly. MOSIS offers minimum (e.g. 40 die) and medium (500, 2000 die, etc.) quantities within the regularly scheduled (typically monthly) multiproject runs. Dedicated runs (also known as COT or Customer Owned Tooling) runs are available for all processes. Dedicated runs can be scheduled to start at any time.

Access to Technology
MOSIS provides access to a wide variety of semiconductor processes offered by many different foundries.

Compatibility with Tools and Libraries
A variety of design flows (digital, analog, mixed-signal) can be used with a number of different CAD tools, technology files, design kits, libraries and IP to create designs for processes accessed by MOSIS.